Our laboratory focuses on advanced electronic packaging reliability by integrating electroless copper metallization on substrates with negative-thermal-expansion material design to address conductivity, heat dissipation, thermal stress, and warpage issues.
Research
The research mission of our laboratory is to develop advanced material strategies for electronic packaging reliability, from substrate metallization to thermal expansion control. Therefore, our work focuses on two main directions: electroless copper deposition on substrates, which improves nucleation, adhesion, uniformity, and reliability of metallic interconnects and heat-dissipation layers; and negative thermal expansion materials, which are designed to compensate thermal expansion mismatch and reduce thermal stress and warpage in packaging systems.
Our unique feature is the integration of surface engineering, metallization processes, and thermomechanical reliability, bridging fundamental material design with practical advanced packaging applications.